ICT/FCT contacts metric sizes
The most common test methods in the quality inspection of electronic assemblies are the In-Circuit Test (ICT), the MDA test (Manufacturing Defects Analysis) and the Functional Test (FCT). Each test method has it‘s limits in terms of test coverage and fault detection and diagnosis, so it often makes sense to combine different test methods with each other. In all these cases a device filled with spring contact probes is needed which creates the electrical connection between UUT (Unit Under Test) and the testing electronics.
In the section ICT/FCT contacts the most common designs of test probes are shown. Most of them are compatible with other brands on the international market. If you find yourself getting lost in the great selection, please just call us - we assist you in direct consultation.
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